Introducing Our New RF Filter Product Line

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Wire Bond and Ribbon Bond Limits Design Guide

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After four decades of growing in experience and expertise, NEO Tech has emerged as North America’s largest assembler of hybrid and microwave microelectronics.  Many of our competitors have not survived the challenges of controlling costs and risk in these technologies. But NEO Tech has thrived by offering our customers an unmatched understanding of materials, production equipment, standardized processes and defect-elimination approaches.

Our Wire Bond and Ribbon Bond Limits Design Guide

Click the button below to download the Wire Bond and Ribbon Bond Limits Design Guide. For more information on NEO Tech’s capabilities and products, contact us at (818) 734-6559.

 

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