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SMT Sub-Assembly Design Guide

There is a constant drive towards using new smaller SMT packages, Flip Chips, wafer scale packages, miniature connectors, flexible PWBs to miniaturized electronic systems for sensors, hand-held electronics, RF/Microwave transmit and receive modules, and wearable electronics. Other applications include optoelectronic assemblies, flexible electronic assemblies, medical devices, and internet-of-things (IOT) hardware.

NEO Tech’s board-level assembly processes support customers with needs from extremely low cost to extremely high reliability. We offer continuous, contiguous, automatic, and cellular manufacturing line configurations to service a wide range of volumes and product mixes.

Complete this form to download NEO Tech’s PCBA/SMT Sub-Assembly Design Guide.