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New Advancement ??? Wire Bonding & Die Attach | NEO Technology Solutions - NEO Tech

Introducing Our New RF Filter Product Line

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New Advancement ??? Wire Bonding &
MMIC Die Attach

New Advancement ??? Automated Epoxy Attachment of Large Thin MMIC Die with Very Little Voiding

Typically these thin die have been restricted to smaller designs due to their tendency to crack. We have developed a new advancement in automated epoxy attachment.

 

Complete this form to learn more and view a thin die being attached to a ceramic substrate.