Introducing Our New RF Filter Product Line

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New Advancement – Wire Bonding &
MMIC Die Attach

New Advancement – Automated Epoxy Attachment of Large Thin MMIC Die with Very Little Voiding

Typically these thin die have been restricted to smaller designs due to their tendency to crack. We have developed a new advancement in automated epoxy attachment.

Our New Advancement in Wire Bonding & MMIC Die Attach

We now have video evidence highlighting our new advancements in Wire Bonding & MMIC Die Attach.

At the right is a large 2 mil thick die. We use an automated epoxy attach method. Watch as the conductive epoxy flows evenly to minimize voids. We have successfully developed this process for a variety of applications include defense, advanced telecommunication devices, the next generation of wearable technologies, and advanced implantable medical devices.

Typically these thin die have been restricted to smaller designs due to their tendency to crack. It has been very expensive and very unreliable to do what we are illustrating. However, with NEO Tech’s focus on reliability, we have confidence that this can be an option for both prototyping as well as manufacturing at scale.

Our process begins by transferring conductive epoxy in a complete pattern with volume repeatability of better than 2%. We then attach the die using a custom pick tool and very well controlled process.

 

Thank you for your interest.

For more information on this service, or our company, contact Jonathan at (818) 734-6559